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I found some interesting information about Anisotropic Conductive Adhesion material:
IBM's technology
Here is the different products available:
Product Number: Z31030
Product Name: Oxy-Bond 404 Electrically Conductive Epoxy
Description:
Medium viscosity, silver filled epoxy system designed to be used for die attach applications. This low ionic grade, electrically conductive adhesive has been specifically formulated to provide a smooth dot profile, even when cured at temperatures as low as 60 degrees C.
Product Information
Available in package of 2.5 grams.
Available in package of 10 grams.
OEM Name - Resin Technology
Product Number: Z31032
Product Name: Oxy-Bond 405 Silver Conductive Epoxy
Description:
A stress-absorbing and electrically conductive, silver-filled epoxy adhesive recommended for solder replacement in microelectronic interconnect applications. This one-part, smooth paste formulation of refined pure silver and epoxy develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic laminates. OXY-BOND 405 is screen printable, and capable of in line surface mount component attach assembly operations.
Product Information
Available in package of 2.5 grams.
Available in package of 10 grams.
OEM Name - Resin Technology
Product Number: Z31036
Product Name: Oxy-Bond 451 Silver Conductive Epoxy
Description:
OXY-BOND 451 is an electrically conductive, silver filled epoxy adhesive reccommended for electronic bonding and sealing applications. This one-part, smooth paste formulation of refined pure silver and epoxy develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic laminates. It can also be used for the assembly and repair of electrical modules, printed circuits, wave guides, flat cable and high frequency shields.
Product Information
Available in package of 2.5 grams.
Available in package of 10 grams.
OEM Name - Resin Technology
Product Number: 3m01
Product Name: 3M� Z-Axis Adhesive Film 7303
Description:
It is used to electrically connect and mechanically bond flexible printed circuits to printed circuit boards and other flex circuits. The low temperature bonding permits bonding both silver ink/polyester and copper/polyimide type flexible circuits. It is ideal for membrane switch flex to PCB, PCB flex to PCB, and touch screen flex to PCB interconnects. Compared to electrical connectors, it offers lower profile, greater design flexibility, and lower cost. It is an anisotropic, electrically conductive, thermoset adhesive film. It is a slightly tacky, heat and pressure-cured system consisting of an adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness (the "Z-axis"), but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. The thermoset adhesive provides for stability in the mechanical and electrical properties under many demanding environmental conditions including thermal cycling and high humidity storage. The tacky nature of the adhesive film, prior to cure, allows for room temperature application as well as alignment and temporary attachment of the flex to the PCB prior to thermal bonding.
Product Information
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Product Number: 3m02
Product Name: 3M� Z-Axis Adhesive Film 5303R-2
Description:
It is used to electrically connect and mechanically bond polyimide based flexible printed circuits to a variety of electronic subsrates and metallizations including printed circuit boards, glass substrates (LCD and flat panel displays) and other polyimide flex circuits. This tape is ideal for fine pitch applications such as laptop and instrument displays, cellular phones and PCB to PCB flex jumper connections. It is an anisotropic, electrically conductive, thermoset adhesive film. It is a non-tacky, heat and pressure-cured system consisting of an adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness (the "Z-axis"), but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. It is available in two thicknesses to allow for systems with different thickness metallizations. The 1 mil thick product is ideal when one or both of the circuits are a thin film metallization. Use to bond flexible circuits to flat panel and liquid crystal displays and printed circuit boards. 1.0 mil thick, 2.0 mil liner.
Product Information
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